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KH-602

This product is used as an additive for phenolic and epoxy molding compounds, can reduce the moisture absorption of the compound after molding. The wet electrical performance can thus be improved, particularly at low frequencies.

Product Introduction

1. Product Chemical Name: N-β-(aminoethyl)-gamma aminopropyl methyl dimethoxy silane

2. Foreign Corresponding Brand: A- 2120(GE) KBM-602 (Shinyue, Japan)

3. molecular formula: NH2(CH2)2Sound box (CH)2)3YOURSELF3(OCH)3)2

4.CAS NO. 3069-29-2

5. molecular weight 206 flash point 93 ℃ boiling point 256 ℃

6. technical indicators

7. performance and application

● Foundry industry

This product is a silane coupling agent containing double amino functional groups, which has good stability in aqueous systems. This product is added to the furan resin, can extend the storage period and stability of the resin. The performance of the product in the cast product is significantly better than KH-550.

● Textile industry

The amino modified silicone oil made by this product is used in textile products to make textiles (cotton, chemical fiber, velvet, wool, leather, etc.) more soft, smooth, breathable, waterproof and more elastic.

● polysulfide sealant

When added to a single two-component polysulfide sealant, this product provides better adhesion to substrates, including glass, aluminum and steel. Typical dosage of this product is 0.5-1.0 parts by weight of sealant. It can be well dispersed in the sealant, and the internal destruction of the resin can be achieved instead of the destruction of the interfacial bonding layer between the sealant and the substrate.

In addition, the use of this product can avoid the use of primer process for bonding.

● Plastisol sealant

In the plastic soluble sealant with this product to replace the polyamide adhesion promoter, can improve the adhesion with the metal substrate, increase the strength. Silane-modified ones have better overall properties than those with polyamide systems. Moreover, the modified system is light in color and does not produce bubbles after curing.

● Added in phenolic resin and epoxy molding compound

This product is used as an additive for phenolic and epoxy molding compounds, can reduce the moisture absorption of the compound after molding. The wet electrical performance can thus be improved, particularly at low frequencies.

● Applicable resins: furan resin, phenolic resin, RTV resin, tripolyamine, D4, DMC, PA, PU, etc.

● Packing: 5kg * 4 barrels/box

● Storage and expiration date: sealed and stored in a cool, dry and ventilated place, away from light and heat insulation. The validity period is one year, and the expired products can only be used after passing the test.

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